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1

[IEEE 2014 4th IEEE International Conference on Information Science and Technology (ICIST) - Shenzhen, China (2014.4.26-2014.4.28)] 2014 4th IEEE International Conference on Information Science and Technology - A combined approach for master-slave robotic surgery system control based on Jacobian and PD algorithm

Zhang, Zhonglin, Xiong, Jing, Gan, Yangzhou, Zhang, Dongwen, Xia, Zeyang

Year:

2014

Language:

english

File:

PDF, 169 KB

english, 2014

2

[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Effects of passivation layer on stress relaxation in Cu line structures

Dongwen Gan,, Sean Yoon,, Ho, P.S., Cresta, P., Singh, N., Bower, A.F., Jihperng Leu,, Shankar, S.

Year:

2003

Language:

english

File:

PDF, 279 KB

english, 2003

3

Feasibility of an Ag-alloy film as a thin-film transistor liquid-crystal display source/drain material

C. O. Jeong, N. S. Roh, S. G. Kim, H. S. Park, C. W. Kim, D. S. Sakong, J. H. Seok, K. H. Chung, W. H. Lee, Dongwen Gan, Paul S. Ho, B. S. Cho, B. J. Kang, H. J. Yang, Y. K. Ko, J. G. Lee

Journal:

Journal of Electronic Materials

Year:

2002

Language:

english

File:

PDF, 363 KB

english, 2002

4

Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements

Gan, Dongwen, Ho, Paul S., Huang, Rui, Leu, Jihperng, Maiz, Jose, Scherban, Tracey

Journal:

Journal of Applied Physics

Year:

2005

Language:

english

File:

PDF, 785 KB

english, 2005

5

Effect of passivation on stress relaxation in electroplated copper films

Gan, Dongwen, Ho, Paul S., Pang, Yaoyu, Huang, Rui, Leu, Jihperng, Maiz, Jose, Scherban, Tracey

Journal:

Journal of Materials Research

Year:

2006

Language:

english

File:

PDF, 250 KB

english, 2006

6

Isothermal stress relaxation in electroplated Cu films. II. Kinetic modeling

Huang, Rui, Gan, Dongwen, Ho, Paul S.

Journal:

Journal of Applied Physics

Year:

2005

Language:

english

File:

PDF, 488 KB

english, 2005

7

[AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: Seventh International Workshop on Stress-Induced Phenomena in Metallization - Austin, Texas (USA) (14-16 June 2004)] AIP Conference Proceedings - Effects of Passivation Layer on Stress Relaxation and Mass Transport in Electroplated Cu Films

Year:

2004

Language:

english

File:

PDF, 503 KB

english, 2004

8

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Effects of dielectric material and linewidth on thermal stresses of Cu line structures

Dongwen Gan,, Guotao Wang,, Ho, P.S.

Year:

2002

Language:

english

File:

PDF, 247 KB

english, 2002

9

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Effects of bump metallurgies, underfill material and its cure process on package warpage

Zhang, Jieping, Dongwen Gan,, Jinlin Wang,, Jayaraman Saikumar,, Li-Hsin Chang,

Year:

2010

Language:

english

File:

PDF, 665 KB

english, 2010

10

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Investigation of Residual Stress in Wafer-Level Interconnect Structures Induced by Wafer Processing

Guotao Wang,, Dongwen Gan,, Groothuis, S., Ho, P.S.

Year:

2006

Language:

english

File:

PDF, 503 KB

english, 2006

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